BERGQUIST® SIL PAD TSP K900, The original thermally conductive polyimide-based insulator
BERGQUIST® SIL PAD TSP K900 uses a specially developed film with high thermal conductivity, high dielectric strength and high durability. BERGQUIST SIL PAD TSP K900 combines the well-known thermal transfer properties of Sil-pad rubber with the physical properties of a film. BERGQUIST SIL PAD TSP K900 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. BERGQUIST SIL PAD TSP K900 is available in custom cuts and shapes.
- Thermal impedance: 0.48°C-in²/W (at 50 psi)
- High voltage support
- High dielectric strength
- Long service life
