BERGQUIST® SIL PAD TSP 1800, thermally conductive elastomeric material, glass fibre reinforced, silicone based, exceptional performance
BERGQUIST® SIL PAD TSP 1800 is a glass fibre reinforced, silicone based thermal interface material with a highly conformable and flexible surface. The material has a non-sticky surface for effective repositioning and easy use, as well as an optional adhesive coating. BERGQUIST SIL PAD TSP 1800 offers exceptional thermal performance with lower application pressures. The material is ideal for placement between power electronic devices and a heat sink for applications mounted with screws and clamps.
- Thermal impedance: 0.53°C-in2/W (at 50 psi)
- Exceptional thermal performance at lower application pressures
- Remarkable surface wetting and breakaway values
- Flexible and non-sticky on both sides for easy repositioning, use and reduced assembly errors
