BERGQUIST® SIL PAD TSP 1600S, silicone-based insulator, reinforced with fibreglass
The real workhorse of the SIL PAD product family, BERGQUIST® SIL PAD TSP 1600S thermally conductive insulating material is designed for a wide range of applications requiring thermal performance and electrical insulation. These applications also typically have low mounting pressures for component clamping. BERGQUIST SIL PAD TSP 1600S material has both a smooth, highly conformable surface and high thermal conductivity. These characteristics optimise thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted on spring clips. Spring clips facilitate quick mounting and apply limited force to the semiconductor. The smooth surface of BERGQUIST SIL PAD TSP 1600S minimises interface thermal resistance and maximises thermal performance.
- Thermal impedance: 0.61 °C-in²/W (at 50 psi)
- Smooth and highly flexible surface
- Electrically insulating
- Low assembly pressures
