BERGQUIST® GAP PAD® TGP HC1000, gap filler material with ‘gel-like’ modulus
BERGQUIST® GAP PAD® TGP HC1000 is an extremely conformable low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The gel-like modulus allows this material to fill air gaps to improve the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is supplied with removable protective coatings on both sides of the material.
- Thermal conductivity: 1.0 W/m-K
- ‘Gel-like’ module
- Reinforced with fibreglass to resist shearing and tearing
- Extremely compliant, low hardness
