BERGQUIST® GAP PAD® TGP 800VO, Conformable, thermally conductive material for filling air gaps
BERGQUIST® GAP PAD® TGP 800VO is a cost-effective, thermally conductive interface material. The material is a thermally conductive polymer filled with glass fibre and coated with rubber, making it easy to handle. The conformable nature of BERGQUIST GAP PAD TGP 800VO allows the pad to fill air gaps between computer boards and heat sinks or metal chassis.
- Increased resistance to puncture, shearing and tearing
- Thermal conductivity: 0.8 W/m-K
- Conformable gap-filling material
- Electrical insulator
