BERGQUIST® GAP PAD® TGP 3500ULM, silicone-based pad, highly conformable, thermally conductive, ultra-low modulus, glass fibre reinforced.
BERGQUIST® GAP PAD® TGP 3500ULM (ultra-low modulus) is an extremely flexible gap filler material with a nominal thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures thanks to its unique 3.5 W/m-K filler and ultra-low modulus resin formulation. The improved material is well suited for high-performance applications requiring extremely low assembly stress. BERGQUIST GAP PAD TGP 3500ULM retains a conformable nature that provides excellent interface and wetting characteristics, even on rough and/or uneven surfaces. BERGQUIST GAP PAD TGP 3500ULM, available with and without glass fibre, has a higher intrinsic natural tack on one side of the material, eliminating the need for bulky thermal adhesive layers. The top has minimal tack for easy handling. BERGQUIST GAP PAD TGP 3500ULM is supplied with protective coatings on both sides.
- Thermal conductivity: 3.5 W/m-k
- Reinforced with fibreglass, resistant to perforation, shearing and tearing
- Highly conformable and retains structural integrity with extremely low compressive stress
- Fibre glass-free option for applications requiring reduced stress
