BERGQUIST GAP PAD TGP 3000, reinforced, flexible, class S gap filler material, thermally conductive.
BERGQUIST® GAP PAD TGP 3000 is a flexible gap filler material with a nominal thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures thanks to its new 3 W/m-K filler and ultra-low modulus resin formula. It is reinforced for easy handling and resistance to puncture, shear and tear. It is well suited for low-stress, high-performance applications typically using stacked or stapled mounting. BERGQUIST GAP PAD TGP 3000 maintains a conformable, still elastic nature that provides excellent interface and wetting characteristics, even on very rough or uneven surfaces.
BERGQUIST GAP PAD TGP 3000 has inherent natural tack on both sides of the material, eliminating the need for additional heat-insulating adhesive layers. The material's inherent natural tack ensures temporary bonding characteristics during assembly. BERGQUIST GAP PAD TGP 3000 is supplied with protective coatings on both sides. The top has reduced tack for easy handling.
- Thermal conductivity: 3.0 W/m-K
- Low thermal resistance Class S with very low pressures
- Highly conformable Class S flexibility
- Designed for low-stress applications
