BERGQUIST GAP PAD 2202SF, polymer pad, silicone-free, high-performance thermally conductive, fibreglass backing.
- high-performance, thermally conductive gap filler with a thermal conductivity of 2.0 W/m-K.
- without silicone and offers exceptionally low interface resistances to adjacent surfaces.
- specially designed for silicone-sensitive applications.
- The material construction features a 0.5 mil PET film on one side and natural tack on the other.
- The natural tack eliminates the need for an additional adhesive layer.
