BERGQUIST® GAP PAD® TGP 1000VOUS

bergquist-gap-pad-tgp-1000vous

BERGQUIST® GAP PAD® TGP 1000VOUS, ultra-conformable, thermally conductive material for filling air gaps

BERGQUIST® GAP PAD® TGP 1000VOUS is recommended for applications requiring minimal pressure on components. The viscoelastic nature of the material also ensures excellent low-stress vibration damping and shock absorption characteristics. BERGQUIST GAP PAD TGP 1000VOUS is an electrically insulating material that can be used in applications requiring insulation between heat sinks and bare lead high-voltage devices.

  • Highly conformable, low hardness
  • Thermal conductivity: 1.0 W/m-K
  • Gel module
  • Reduced tension
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BERGQUIST-GAP-PAD-TGP-1000VOUS-en_GL.pdf