BERGQUIST® GAP FILLER TGF 3600, thermally conductive gap filler, two-part, liquid
BERGQUIST® GAP FILLER TGF 3600 is the state-of-the-art technology in thermally conductive gap fillers, thanks to its extremely high thermal performance and extreme flexibility. The material is a two-part liquid gap filler that cures at room temperature or at elevated temperatures. Before curing, the material retains good thixotropic properties and low viscosity. The result is a liquid-like material for filling air gaps and voids that remains fluid when external force is applied (e.g. during assembly or distribution processes). The material is an excellent solution for interfacing fragile components with high topographical and/or tack tolerances with universal housings or heat sinks. Once cured, it remains a low-modulus elastomer that reduces CDT stresses during thermal cycling while retaining enough modulus to prevent interface suction. BERGQUIST GAP FILLER TGF 3600 adheres slightly to the surface, thereby improving surface area contact. BERGQUIST GAP FILLER TGF 3600 is not designed to be used as a structural adhesive.
- Thermal conductivity: 3.6 W/m-K
- Ultra-conformable, designed for fragile and low-stress applications
- Two-component formula for easy storage
- Its thixotropic properties make it easy to apply
