BERGQUIST® GAP FILLER TGF 2000, high-performance, thermally conductive liquid gap filler
BERGQUIST® GAP FILLER TGF 2000 is a high-performance, thermally conductive, liquid gap filler supplied in two components, a system that cures at room temperature or at elevated temperatures. The material guarantees a balance between the properties of the cured material and good permanent compression (memory). The result is a flexible elastomer that sets upon application, ideal for bonding ‘hot’ electronic components mounted on printed circuit boards close to a metal housing or heat sink. Before curing, it flows under pressure like a grease. After curing, it does not pump the interface as a result of thermal cycling and is dry to the touch. Unlike cured joint fillers, the liquid offers infinite thicknesses with virtually no stress during movement and assembly. It also eliminates the need for specific gasket thicknesses and cut-out shapes for individual applications. BERGQUIST FILLER TGF 200 is designed for thermal interface applications where a strong structural bond is not required.
- Ultra-conformable, designed for fragile and low-stress applications
- Thermal conductivity: 2.0 W/m-K
- Room temperature and accelerated curing processes
- Room temperature and accelerated curing processes
