BERGQUIST GAP FILLER TGF 1400SL, liquid gap filler, low viscosity, thermally conductive, two-part
BERGQUIST® GAP FILLER TGF 1400SL is a liquid, thermally conductive, silicone-based, two-part gap filler. This material has extremely low viscosity to facilitate self-levelling and filling of voids, resulting in excellent heat transfer. Unlike hardened thermal pad materials, a liquid product offers infinite variations in thickness with little or no stress on sensitive components during assembly. When cured, BERGQUIST GAP FILLER TGF 1400SL provides a flexible, thermally conductive elastomer formed in place, ideal for fragile assemblies and for filling unique and intricate gaps. BERGQUIST GAP FILLER TGF 1400SL, which has low natural tack characteristics, is designed for applications that do not require strong structural adhesion.
- Self-levelling
- Thermal conductivity: 1.4 W/m-K
- Vibration damping
- Very flexible
