BERGQUIST® GAP FILLER TGF 1100SF, low-viscosity, two-part, silicone-free, thermally conductive liquid gap filler
BERGQUIST® GAP FILLER TGF 1100SF is the thermal solution for silicone-sensitive applications The material is supplied as a two-part component that cures at room temperature or at elevated temperatures. The material has low modulus properties and cures into a soft, flexible elastomer, reducing thermal cycling stresses during operation and virtually eliminating stress during assembly in low-stress applications.
- Thermal conductivity: 1.1 W/m-k
- No outgassing or silicone extraction
- Ultra-conformable, designed for fragile and low-stress applications
- Room temperature and accelerated curing processes
