BERGQUIST® GAP FILLER TGF 1000SR, liquid, two-component gap filler, thermally conductive vibration damping
BERGQUIST® GAP FILLER TGF 1000SR is a liquid, thermally conductive, two-component gap filler with remarkable resistance to collapse. The mixed system cures at room temperature and can be accelerated by applying heat. Unlike cured thermal pad materials, a liquid product offers infinite variations in thickness with little or no stress on sensitive components during assembly. When cured, BERGQUIST GAP FILLER TGF 1000SR provides a flexible, thermally conductive elastomer that is ideal for fragile assemblies or for filling single and intricate gaps and voids. BERGQUIST GAP FILLER TGF 1000SR, which has low natural tack characteristics, is designed for applications that do not require strong structural adhesion.
- Thermal conductivity: 1.0 W/m-K
- Excellent collapse resistance (remains in place)
- Ultra-conformable, with excellent wettability for low-stress interface applications
- 100% dry material, no curing by-products
