Next-generation COM-HPC module, ESM-HRPL, along with the high-performance carrier board EEV-HC10. Designed for compute-intensive edge applications such as AI inference, smart healthcare, industrial automation, and intelligent energy systems, this solution delivers exceptional performance, modular scalability, and long-term product availability.
Compliant with PICMG® COM-HPC® Client Type specification, ESM-HRPL supports Intel® 12th/13th/14th Gen Core™ processors (LGA 1700, up to 65W TDP) and integrates the Intel® R680E chipset.
Main Features:
- Intel® R680E chipset
- Intel® 12/13/14th Core™ i9/i7/i5/i3 Processor, supports up to 65W Max
- 4 x 262-Pin DDR5 SO-DIMM supports up to 128GB, 3600~4000MT/s, optional ECC support (CPU depending)
- 1 x PCIex16 Gen5, 1 x PEGx4, 2 x PCIex4, 9 x PCIex1 Gen3, 1 x PCIex1 Gen3 for BMC
- 2 x Intel® i226-V 2.5G Gigabit Ethernet Controller
- 3 x DDI, 1 x eDP
- 4 x USB3.2 Gen2x2, 8 x USB2.0, 2x SATAIII
- 1 x Audio, 1 x I2C, 1 x SMBus, 1 x GSPI, 1 x IPMB, 1 x SPI
- Standard 0°C ~ 60°C (32°F ~ 140°F)
